Electrostatically Actuated Micromirror Array Assembled by Using Solder Flip Chip Bonding and Electro-Thermal Fuse-Away Tethers

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ژورنال

عنوان ژورنال: Journal of Japan Institute of Electronics Packaging

سال: 2005

ISSN: 1343-9677,1884-121X

DOI: 10.5104/jiep.8.108